Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

By Yi-Hsin Pao and John H. Lau

Dealing with BGA, CSP, flip chips and other new technologies that underlie the electronics industry's need for smaller, faster products, this text explains the fundamentals of solder joint reliability... This description may be from another edition of this product.

• Format: Hardcover
• Language: English
• ISBN: 0070366489
• ISBN13: 9780070366480
• Release Date: September 1996
• Publisher: McGraw-Hill Professional Publishing
• Length: 408 Pages
• Weight: 1.86 lbs.
• Dimensions: 1.4" x 6.3" x 9.3"

Customer Reviews

Good

The book was in great condition and came on time. It is actually a very good first foundation book.