Semiconductor Advanced Packaging

By John H. Lau

Book Overview

Recent Advance on Semiconductor Packaging.- System-in-Package.- Fan-In Wafer/Panel-Level Chip-Scale Packages.- Fan-Out Wafer/Panel-Level Packaging.- 2D, 2.1D, and 2.3D IC Integration.- 2.5D IC Integration.- 3D IC Integration.- Hybrid Bonding.- Chiplets Packaging.- Dielectric Materials.- Trends and Roadmap for Advanced Semiconductor Packaging.

• Format: Hardcover
• Language: English
• ISBN: 9811613753
• ISBN13: 9789811613753
• Release Date: May 2021
• Publisher: Springer
• Length: 498 Pages
• Weight: 1.99 lbs.
• Dimensions: 1.1" x 6.1" x 9.2"