Reliability, Stress Analysis, and Failure Prevention Issues in Adhesive and Bolted Connections

By American Society of Mechanical Engineers

Contains the 16 papers presented at the November 1999 symposium. The topics include temperature distribution in a VLSI chip due to dynamic power density, the strength of joints combining adhesives with bolts, optimization of adhesively bonded single lap joints by adhered notching, and estimation of

• Format: Paperback
• Language: English
• ISBN: 0791816591
• ISBN13: 9780791816592
• Release Date: January 1999
• Publisher: American Society of Mechanical Engineers
• Length: 171 Pages