Microvias: For Low Cost, High Density Interconnects

By John H. Lau and S.W. Ricky Lee

Book Overview

A guide to microvias technology. It covers technology basics, design methods, heat concerns and developments, and surveys companies and products. Microvias products are essential to small mobile... This description may be from another edition of this product.

• Format: Hardcover
• Language: English
• ISBN: 0071363270
• ISBN13: 9780071363273
• Release Date: April 2001
• Publisher: McGraw-Hill Professional Publishing
• Length: 565 Pages
• Weight: 3.40 lbs.
• Dimensions: 1.8" x 6.4" x 9.3"