Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies

By John H. Lau

Low-Cost Flip Chip Technologies:For DCA, WLCSP, and PBGA AssembliesJohn H. LauThe first comprehensive and in-depth guide to low-cost flip chip technologies, this reference gives you cutting edge... This description may be from another edition of this product.

• Format: Hardcover
• Language: English
• ISBN: 0071351418
• ISBN13: 9780071351416
• Release Date: February 2000
• Publisher: McGraw-Hill Professional Publishing
• Length: 585 Pages
• Weight: 2.50 lbs.
• Dimensions: 1.8" x 6.3" x 9.3"