Introduction to Microelectronics Advanced Packaging Assurance

By Navid Asadizanjani, Hamed Dalir, Himanandhan Reddy Kottur

This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions.

• Format: Hardcover
• Language: English
• ISBN: 3031861019
• ISBN13: 9783031861017
• Release Date: May 2025
• Publisher: Springer
• Length: 183 Pages