Fan-Out Wafer-Level Packaging

By John H Lau

Book Overview

Patent Issues of Fan-out Wafer-Level Packaging.- Flip Chip Technology vs. FOWLP.- Fan-In Wafer-Level Packaging vs. FOWLP.- Embedded Chip Packaging.- FOWLP: Chip-First and Die Face-Down.- FOWLP: Chip-First and Die Face-Up.- FOWLP: Chip-Last or RDL-First.- FOWLP: PoP with FOWLP.- Fan-Out Panel-Level Packaging (FOPLP).- 3D Integration.- Heterogeneous Integration.

• Format: Hardcover
• Language: English
• ISBN: 9811088837
• ISBN13: 9789811088834
• Release Date: April 2018
• Publisher: Springer
• Length: 303 Pages
• Weight: 1.39 lbs.
• Dimensions: 0.8" x 6.1" x 9.2"