Ball Grid Array Technology

By John H. Lau

This text covers ball grid array (BGA) design and manufacturing. BGA is a relatively new way of connecting leads from an integrated circuit package to a printed circuit board, allowing a higher pin... This description may be from another edition of this product.

• Format: Hardcover
• Language: English
• ISBN: 007036608X
• ISBN13: 9780070366084
• Release Date: November 1994
• Publisher: McGraw-Hill Professional Publishing
• Length: 636 Pages
• Weight: 2.10 lbs.
• Dimensions: 1.8" x 6.2" x 9.3"