Assembly and Reliability of Lead-Free Solder Joints

By John H. Lau

Book Overview

This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by... This description may be from another edition of this product.

• Format: Paperback
• Language: English
• ISBN: 9811539227
• ISBN13: 9789811539220
• Release Date: May 2021
• Publisher: Springer
• Length: 527 Pages
• Weight: 2.00 lbs.
• Dimensions: 1.0" x 8.0" x 9.2"